DOD Contract : FA811207MJ283 | FA8112-07-M-J283
There are 2 government contract actions against this contract. The procuring agency is 5700: AIR FORCE, Department of the (Headquarters, USAF).
It has been awarded to CRESTWOOD TECHNOLOGY GROUP CORPORATION located in , NY.
This contract includes procurement for MICROCIRCUIT,LINEAR and BEARING,SLEEVE.
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| DOD Contracts | Delivery Order | Line Item | Quantity | Price | Agency | Award Date | fa811207mj283 | 0001 | Free Trial | 5700: AIR FORCE, Department of the (Head | 2007-02-02 | fa811207mj283 | 0002 | Free Trial | 5700: AIR FORCE, Department of the (Head | 2007-02-02 |
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Federal Supply Classes for FA811207MJ283
3120 - Bearings, Plain, Unmounted
Includes: Includes Sleeve Bearings; Split Bearings; Washer Type Bearings; Jewel Bearings.
Excludes: Excludes Antifriction Bearings (FSC 3110); Mounted Bearings (FSC 3130).
Note: Note-Bearings in this class are generally one piece that retain and position moving and/or rotating parts. They may have lubrication grooves/fittings/facilities or include pre-lubrication.
5962 - Microcircuits, Electronic
Includes: Includes Integrated Circuit Devices; Integrated Circuit Modules, Integrated Electronic Devices: Hybrid, Magnetic, Molecular, Opto-Electronic, and Thin Film.
Excludes: Excludes Single Circuit Elements such as Capacitors; Resistors; Diodes and Transistors; Printed Circuit Boards and Circuit Card Assemblies; and Filters and Networks.
Note: Note-(1) A microcircuit is defined as follows: A small circuit having a high equivalent circuit element density, which is considered as a single part composed of interconnected elements placed and/or formed on or within a single substrate to perform an electronic circuit function. The elements may be formed on or within a semiconductor material substrate; may consist of conductive film(s) formed on an insulating substrate; or may be a combination of one or both of these types with discrete elements. (2) The term "microcircuit", as applied to circuit devices included in this class, is delimited to exclude items consisting solely of interconnected "microcomponents" (discrete miniaturized components). Also excluded are items fabricated in the form of monolithic thick-film or thin-film structures that in themselves are not functional electronic circuits (e.g., Capacitors, Resistors, Transistors, or "arrays" thereof).
