DOD Contract : DAAB0794DF005 | DAAB07-94-D-F005
There are 6 government contract actions against this contract. Execution of this contract spans from May 5, 1994 and February 2, 1997. The procuring agency is 2100: ARMY, Department of the (except Corps of Engineers Civil Program Financing).
It has been awarded to STAR DYNAMIC CORP located in , NJ.
This contract includes procurement for INTERFACE UNIT,AUTO; INTERFACE UNIT,COMM; and CABLE ASSEMBLY,SPEC.
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| DOD Contracts | Delivery Order | Line Item | Quantity | Price | Agency | Award Date | daab0794df005 | 0002 | Free Trial | 2100: ARMY, Department of the (except Co | 1997-02-06 | daab0794df005 | 0003 | Free Trial | 2100: ARMY, Department of the (except Co | 1996-03-21 | daab0794df005 | 0001 | Free Trial | 2100: ARMY, Department of the (except Co | 1994-05-25 | daab0794df005 | 0004 | Free Trial | 2100: ARMY, Department of the (except Co | 1994-05-25 | daab0794df005 | 0005 | Free Trial | 2100: ARMY, Department of the (except Co | 1994-05-25 | daab0794df005 | 0006 | Free Trial | 2100: ARMY, Department of the (except Co | 1994-05-25 |
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Federal Supply Classes for DAAB0794DF005
5962 - Microcircuits, Electronic
Includes: Includes Integrated Circuit Devices; Integrated Circuit Modules, Integrated Electronic Devices: Hybrid, Magnetic, Molecular, Opto-Electronic, and Thin Film.
Excludes: Excludes Single Circuit Elements such as Capacitors; Resistors; Diodes and Transistors; Printed Circuit Boards and Circuit Card Assemblies; and Filters and Networks.
Note: Note-(1) A microcircuit is defined as follows: A small circuit having a high equivalent circuit element density, which is considered as a single part composed of interconnected elements placed and/or formed on or within a single substrate to perform an electronic circuit function. The elements may be formed on or within a semiconductor material substrate; may consist of conductive film(s) formed on an insulating substrate; or may be a combination of one or both of these types with discrete elements. (2) The term "microcircuit", as applied to circuit devices included in this class, is delimited to exclude items consisting solely of interconnected "microcomponents" (discrete miniaturized components). Also excluded are items fabricated in the form of monolithic thick-film or thin-film structures that in themselves are not functional electronic circuits (e.g., Capacitors, Resistors, Transistors, or "arrays" thereof).
5995 - Cable, Cord, and Wire Assemblies: Communication Equipment
Includes:
Excludes: Excludes Cable Assemblies, Fiber Optic.
Note: Note-This class includes only those types of cable, cord, and Wire Assemblies and Sets (and Wiring Harnesses) used on or with equipment and components covered by Groups 58, 59 and 70. Cable, Cord, Wire Assemblies, and Sets (Wiring Harnesses) used on or with equipment classified in FSC Groups other than Groups 58, 59, or 70 are classified in FSC Class 6150 if multiapplication, or classified with the next higher classifiable assembly if specially designed.
7025 - ADP Input/Output and Storage Devices
Includes:
Note: Note-This class includes devices used to control and transfer information to and from a Computer (as modified). The input device is used for transferring data and instructions into a computer. The output device is used to transfer results of processing by the computer to ADP peripheral devices. Input/output devices combine the above functions in the same device. This class includes printers, display units, disk drive units (magnetic, optical and floptical), tape drive units, terminals, data entry devices and transfer units. Also includes Optical Compact Disk (CD) devices used for the storage and retrieval of data and firmware.
